Honors

Awards and Recognition

Academic honors, conference best paper awards, and industry innovation prizes recognizing RAIDS contributions to human–robot collaboration, smart manufacturing, and industrial embodied intelligence.

  • 9 Academic Honors
  • 9 International Best Conference (Student) Paper Awards
  • 20+ Inventive Patents
  • 10+ Industry & Innovation Awards

Academic Honors

Major career and research recognition at national and international levels.

  • 2026

    Fellow

    American Society of Mechanical Engineers (ASME)

  • 2025

    Highly Cited Researcher

    Clarivate Web of Science · Engineering

  • 2025

    Outstanding Young Engineer of the Year

    Hong Kong Institution of Engineers (HKIE)

  • 2024

    Outstanding Young Manufacturing Engineer Award

    Society of Manufacturing Engineers (SME)

  • 2024

    Excellent Young Scientists Fund

    National Natural Science Foundation of China (NSFC)

  • 2023

    Young Innovative Researcher Award

    The Hong Kong Polytechnic University

  • 2022

    Top 50 Global AI+X Chinese Young Scholars

    Baidu Inc.

  • 2022

    Endowed Young Scholar in Smart Robotics

    Wong Tit Shing Endowment · PolyU

  • 2022

    Third Prize, 1st Youth Science & Technology Forum

    China Association for Science and Technology (CAST)

Best Paper Awards

Selected conference recognitions from RAIDS publications and student research.

  1. Best Student Paper Award

    11th CIRP Conference on Assembly Technologies and Systems (CATS)

  2. Best Paper Award

    IROS Workshop on Generative AI for Robotics and Smart Manufacturing

  3. Second Prize

    CIRPe Conference · International Academy for Production Engineering (CIRP)

  4. Best DMHCA Paper in Technology

    IEEE Robotics & Automation Society

  5. Student Research Presentation Finalist

    52nd ASME/SME North American Manufacturing Research Conference (NAMRC)

  6. Best Conference Paper Award

    NSFC–RGC Conference on Frontiers of Industrial Big Data and Intelligent Systems, Hong Kong

  7. Best Research Award

    27th International Conference on Transdisciplinary Engineering (TE2019), Tokyo

  8. Best Paper Award

    11th CIRP Conference on Industrial Product-Service Systems (CIRP IPS2), Hong Kong

Selected Industry & Innovation Awards

Applied research and technology transfer recognised in competitions and invention exhibitions.

  • 2026

    Second Prize

    Hangzhou International Embodied Robot Scenario Application Competition

  • 2025

    Hong Kong Innovation and Technology Award

    CobotAI–ARfit

  • 2024

    Find Smart Tech Innovation Application Case

    Mutual-cognitive human–robot collaborative manufacturing system · World Intelligence Industry Expo

  • 2023

    ASMPT Outstanding Award

  • 2023

    Silver Award

    Asia International Innovation Invention Exhibition

  • 2023

    Bronze Award

    48th International Exhibition of Inventions Geneva

  • 2022

    Grand and Gold Award

    2022 HongKong ICT Award (Tertiary or Above)

  • 2022

    Gold Award

    The 8th China International College Students’ “Internet+” Innovation and Entrepreneurship Competition

  • 2021

    Winning Award

    21st Asia Pacific Information and Communications Technology Alliance (APICTA) Awards